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CAVE3 Paper wins 2014/2015 ASME Journal of Electronic Packaging Best Paper Award
The following paper has been selected as the 2014/2015 ASME Journal of Electronic Packaging Best Paper Award winner.
Lall, P., Lowe, R., Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Reliability Under Vibration, ASME Journal of Electronic Packaging, Volume 136, No. 4, doi:10.1115/1.4028163, pp. 041013-1-to 041013-8, December 2014.
The award was conferred at the ASME IMECE 2015 Conference in Houston, TX on Nov 17th, 2015.
Prof. Pradeep Lall (Left) with Prof. Y.C. Lee (Right)
Auburn University’s Lall to Lead the Harsh Environment Node for Flexible Hybrid Electronics Manufacturing Innovation Institute
By: Morgan Stashick
Auburn University has been selected to lead a national manufacturing effort on harsh environment electronics as part of a U.S. Department of Defense led flexible hybrid electronics institute.
On Friday, Aug. 28, at NASA’s Ames Research Center, Department of Defense Secretary Ashton Carter announced a cooperative agreement to the research consortium FlexTech Alliance to establish and manage a Manufacturing Innovation Institute for Flexible Hybrid Electronics, or FHE MII.
FlexTech Alliance, based in San Jose, California, will coordinate the FHE MII, which comprises 96 companies, 11 laboratories and non-profits, 43 universities and 15 state and regional organizations. Auburn University will head the only node in the state of Alabama.
Leading Auburn’s node on harsh environments is Pradeep Lall, the John and Anne MacFarlane endowed professor of mechanical engineering and director of Auburn’s NSF Center for Advanced Vehicle and Extreme Environment Electronics, or CAVE.
“This establishment will provide engineers with the integrated skills and theoretical background for the manufacture of flexible hybrid electronics for extreme environment applications,” said Lall. “It will create intellectual property and expenditures on research, education and related activities, as well as catalyze development of technologies which can be manufactured in the state. We have developed strategic partnerships with industry and research labs in Alabama and nationally for development and demonstration of technologies for harsh environment operation.”
The institute will be awarded $75 million in federal funding over a five-year period and is being matched by more than $96 million in cost sharing from non-federal sources including private companies, universities, not-for-profit organizations and several states, including Alabama.
“The strength of the institute will stem from the strong support and previous work of our partner organizations,” said Michael Ciesinski, CEO of FlexTech Alliance. “Auburn University’s strong work in utilizing electronics in harsh environments will lend the institute a huge advantage in the special needs for that environment. We look forward to collaborating with the excellent team there and the CAVE facility.”
In addition to defense, the institute’s activities will benefit a wide range of markets including automotive, communications, consumer electronics, medical devices, health care, transportation and logistics and agriculture.
“I am pleased that Auburn University is a partner in this national organization, and that Dr. Lall is leading the way for its initiatives on harsh environments,” said Christopher B. Roberts, dean of the Samuel Ginn College of Engineering. “The institute represents an innovative collaboration between the public and private sectors and has the potential to make a huge impact on our nation as we continue to embrace advanced manufacturing.”
The new institute is part of the National Network for Manufacturing Innovation program. The FHE MII is the seventh manufacturing innovation institute announced and the fifth under Department of Defense management. The institutes are intended to bridge the gap between applied research and large-scale product manufacturing, and it is anticipated that Auburn’s harsh environment node will create technologies for the benefit of the nation’s commercial and national defense interests.
Additional Links to Story:
Lall named John and Anne MacFarlane Endowed Professor
Pradeep Lall, director of the National Science Foundation Center for Advanced Vehicle and Extreme Environmental Electronics, has been named the John and Anne MacFarlane Endowed Professor in Auburn University’s Department of Mechanical Engineering.
Lall joined the Samuel Ginn College of Engineering in 2002 and was named the Thomas Walter Professor in 2005. He earned a master’s degree and doctorate in mechanical engineering from the University of Maryland in 1989 and 1993, respectively, and a master of business administration from the Kellogg School of Management at Northwestern in 2002.
“We greatly appreciate John and Anne’s generous gift and their commitment to the College of Engineering,” said Christopher B. Roberts, dean of engineering. “This endowment will help sustain the outstanding work of Pradeep Lall, a talented educator and researcher whose work has led to innovative technology design and advancements in electronic systems.”
As the director of NSF-CAVE3, Lall’s research interests include prognostics health management of automotive and harsh environment electronics; electronics failure mechanisms and modeling; and simulation and electronics reliability. During his 13-year tenure at Auburn, he has secured nearly $20 million in research funding and holds three U.S. patents.
He has served as the adviser for more than 45 doctoral and postdoctoral graduates and master’s degree students and has taught numerous courses at Auburn, as well as short courses throughout the U.S. and Europe. He is the author and co-author of two books, 14 book chapters and more than 430 journal and conference papers.
Among other honors received, Lall is a fellow of the Alabama Academy of Sciences, American Society of Mechanical Engineers and the Institute of Electrical and Electronics Engineers. He is a recipient of the IEEE Exceptional Technical Achievement Award, ASME’s Electronics and Photonics Packaging Division Applied Mechanics Award, Surface Mount Technology Association’s Member of Technical Distinction Award, Auburn University’s Creative Research and Scholarship Award, SEC Faculty Achievement Award and Samuel Ginn College of Engineering Senior Faculty Research Award. He has received three Motorola Outstanding Innovation Awards and five Motorola Engineering Awards.
In addition, he has earned 24 Best Paper Awards at national and international conferences. Lall is the founding faculty adviser for the SMTA student chapter at Auburn University and member of the editorial advisory board for the SMTA Journal.
John and Anne MacFarlane, for whom the professorship is named, are both Auburn graduates. John received bachelor’s and master’s degrees in mechanical engineering in 1972 and 1973, respectively. A retired ExxonMobil executive with 35 years of experience, he has served on the Auburn Alumni Engineering Council. An Auburn native, Anne graduated in 1973 with a bachelor’s degree in secondary education. Through their charitable support, the MacFarlanes hold memberships in the college’s Keystone, Ginn and Eagles societies and the university’s 1856 and Foy societies. Both are members of the Auburn Alumni Association.
News-Link: http://eng.auburn.edu/news/2015/08/coe-lall-professorship.html
CAVE3 Team attends ASME InterPACK and ICNMM 2015 Conference to Present Research Papers
The following students from Professor Lall’s research team visited the ASME InterPACK and ICNMM 2015 Conference in San Franscisco from July 6-9, 2015 to present their research papers:
- Hao Zhang
- Yihua Luo
- Nakul Kothari
- Vikas Yadav
- Shantanu Deshpande
- Junchao Wei
- Amrit Abrol
- Peter Sakalaukus.
Pictured from Left-to-Right: Hao Zhang, Yihua Luo, Nakul Kothari, Vikas Yadav, Professor Pradeep Lall, Shantanu Deshpande, Junchao Wei, Amrit Abrol, Peter Sakalaukus.
CAVE3 Paper wins the Best-Poster Paper Award at the ASME InterPACK and ICNMM 2015
The following CAVE3 paper won the Best-Poster Paper Award at the ASME InterPACK and ICNMM 2015 Conference held in San Francisco, CA on July 6-9, 2015.
Lall, P., Deshpande, S., Nguyen, L., Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded with Different EMC’s, Paper IPACKICNMM2015-48638; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
Pictured from Left-to-Right: Pradeep Lall (AU) and Shantanu Deshpande (AU)
CAVE3 Papers to be Presented at the ASME InterPACK 2015, San Francisco, California, July 6-9, 2015
The following CAVE3 papers will be presented at the ASME InterPACK 2015 in San Francisco, California. Several students are travelling to the conference to present the papers along with Professor Lall.
- Lall, P., Deshpande, S., Nguyen, L., Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded with Different EMC’s, Paper IPACKICNMM2015-48638; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
- Lall, P., Sakalaukus, P., Davis, L., An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions, Paper IPACKICNMM2015-48257; Session 1-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
- Lall, P., Luo, Y., Nguyen, L., Chlorine Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages, Paper IPACKICNMM2015-48639; Session 1-3-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
- Lall, P., Zhang, H., Davis, L., Discoloration and Failure Mechanism Analysis of High Power pc-LED Under Harsh Environment in Presence of Contamination, Paper IPACKICNMM2015-48724; Session 1-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
- Lall, P., Wei, J., LED Chip Deformation Measurement During the Operation Using the X-ray CT Digital Volume Correlation, Paper IPACKICNMM2015-48785; Session 14-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
- Lall, P., Abrol, A., Simpson, L., Glover, J., Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Shock Environments, Paper IPACKICNMM2015-48790; Session 3-1-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
- Lall, P., Yadav, V., Suhling, J., A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures, Paper IPACKICNMM2015-48389; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
- Lall, P., Kothari, N., Glover, J., Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments, Paper IPACKICNMM2015-48457; Session 3-3-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
- Lall, P., Mirza, K., Suhling, J., DIC Based Investigation into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint, Paper IPACKICNMM2015-48727, Session 14-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, July 6-9, 2015
List of CAVE3 papers to be presented at the IEEE PHM Conference in Austin, Texas, June 22-25, 2015
The following CAVE3 papers will be presented at the IEEE PHM 2015 Conference, Austin, TX from June 22-25, 2015.
- Prognostication of Solder-Joint Reliability of 0.4mm and 0.5mm Pitch BGAs Subjected to Mechanical Shocks up to 10,000G, Pradeep Lall, Kalyan Dornala, Junchao Wei, Ryan Lowe, Jason Foley, IEEE PHM Conference, Austin, Texas, pp. 1-14, June 22-25, 2015
- Prognostication of LED Remaining Useful Life and Color Stability in the Presence of Contamination, Pradeep Lall, Hao Zhang, Lynn Davis, IEEE PHM Conference, Austin, Texas, pp. 1-8, June 22-25, 2015
Lall serves as the General Chair of the IEEE PHM 2015
Professor Lall will serve as the General Chair of the IEEE PHM 2015 Conference to be held in Austin, TX in June 22-25, 2015. The conference focuses on prognostics health management systems for a broad array of electrical and electronic systems with emphasis on principles, system design, implementation, applications. The conference will bring together persons from Industry and Academia, including engineers, scientists and managers from around the world to share and discuss the state of the art, state of practice, and future of Prognostics and Health Management. The program includes Tutorials, Panel Sessions, and Papers that address the wide-ranging, interdisciplinary topics related to PHM technology and application. There will be a special working session on the in-process development of a PHM Standard. Additional information about the conference is available on the conference web site at: phmconf.org.
Best-of-Conference Paper of ECTC 2014
The following CAVE3 paper from ECTC 2014 was recognized with the Best-of-Conference Session Paper Award at the ECTC 2015 on May 27, 2015 in San Diego.
Session 9, Paper 2 (ECTC 2014)
Exploration of Aging Induced Evolution of Solder Joints Using Nanoindentation and Microdiffraction, Mohammad Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, and Pradeep Lall, 64th ECTC, pp. 379-394, Orlando, FL, May 27-30, 2014.
List of CAVE3 Papers to be Presented at ECTC 2015, San Diego, May 26-29, 2015
The following CAVE3 papers will be presented at the ECTC, San Diego, May 26-29, 2015
Wednesday, May 27, 2015:
9:00AM (PST) – Session -37/ Paper -4: Failure Mechanisms and Color Stability in Light-Emitting Diodes during Operations in High-Temperature Environments in Presence of Contamination, Pradeep Lall and Hao Zhang- Auburn University; Lynn Davis RTI International
10:00AM (PST) – Session -3/ Paper -4: Thermal Cycling Reliability of Aged PBGA Assemblies- Comparison of Weibull Failure Data and Finite Element Model Predictions, Munshi M. Basit, Mohammad Motalab, Jeffery C. Suhling, Zhou Hai, John Evans, Michael J. Bozack, and Pradeep Lall- Auburn University
1:30PM (PST) – Session -10/ Paper -1: X-Ray Micro- CT and Digital- Volume Correlation Based Three- Dimensional Measurements of Deformation and Strain in Operational Electronics, Pradeep Lall and Junchao Wei- Auburn University
Thursday, May 28, 2015:
8:25AM (PST) – Session -15/ Paper -2: High Strain Rate Properties of SAC305 Lead Free Solder at High Operating Temperature after Long-Term Storage, Pradeep Lall, Di Zhang, and Jeff Suhling- Auburn University
2:00PM (PST) – Session -40/ Paper -8: Principal Components Regression Model for Prediction of Life-Reduction in SAC Lead Free Interconnects During Long-Term High Temperature Storage, Pradeep Lall, Sree Mitun Duraisamy, Jeff Suhling, and John Evans- Auburn University
3:55PM (PST) – Session -24/ Paper -5: Multiphysics- Modeling Corrosion in Copper-Aluminum Interconnects in High Humidity Environments, Pradeep Lall and Yihua Luo- Auburn University; Luu Nguyen- Texas Instruments, Inc.
Friday, May 29, 2015:
3:30PM (PST) – Session -36/ Paper-4: Nanomechanical Characterization of SAC Solder Joints- Reduction of Aging Effects Using Microalloy Additions, Md Hasnine, Jeffery C. Suhling, Barton C. Prorok, Michael J. Bozack, and Pradeep Lall- Auburn University
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