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Monthly Archives: May 2015

Best-of-Conference Paper of ECTC 2014

The following CAVE3 paper from ECTC 2014 was recognized with the Best-of-Conference Session Paper Award at the ECTC 2015 on May 27, 2015 in San Diego.
Session 9, Paper 2 (ECTC 2014)
Exploration of Aging Induced Evolution of Solder Joints Using Nanoindentation and Microdiffraction, Mohammad Hasnine, Jeffrey C. Suhling, Barton C. Prorok, Michael J. Bozack, and Pradeep Lall, 64th ECTC, pp. 379-394, Orlando, FL, May 27-30, 2014.

List of CAVE3 Papers to be Presented at ECTC 2015, San Diego, May 26-29, 2015

The following CAVE3 papers will be presented at the ECTC, San Diego, May 26-29, 2015

 Wednesday, May 27, 2015:

9:00AM (PST) – Session -37/ Paper -4: Failure Mechanisms and Color Stability in Light-Emitting Diodes during Operations in High-Temperature Environments in Presence of Contamination, Pradeep Lall and Hao Zhang- Auburn University; Lynn Davis RTI International

10:00AM (PST) – Session -3/ Paper -4: Thermal Cycling Reliability of Aged PBGA Assemblies- Comparison of Weibull Failure Data and Finite Element Model Predictions, Munshi M. Basit, Mohammad Motalab, Jeffery C. Suhling, Zhou Hai, John Evans, Michael J. Bozack, and Pradeep Lall- Auburn University

1:30PM (PST) – Session -10/ Paper -1: X-Ray Micro- CT and Digital- Volume Correlation Based Three- Dimensional Measurements of Deformation and Strain in Operational Electronics, Pradeep Lall and Junchao Wei- Auburn University

Thursday, May 28, 2015:

8:25AM (PST) – Session -15/ Paper -2: High Strain Rate Properties of SAC305 Lead Free Solder at High Operating Temperature after Long-Term Storage, Pradeep Lall, Di Zhang, and Jeff Suhling- Auburn University

2:00PM (PST) – Session -40/ Paper -8: Principal Components Regression Model for Prediction of Life-Reduction in SAC Lead Free Interconnects During Long-Term High Temperature Storage, Pradeep Lall, Sree Mitun Duraisamy, Jeff Suhling, and John Evans- Auburn University

3:55PM (PST) – Session -24/ Paper -5: Multiphysics- Modeling Corrosion in Copper-Aluminum Interconnects in High Humidity Environments, Pradeep Lall and Yihua Luo- Auburn University; Luu Nguyen- Texas Instruments, Inc.

Friday, May 29, 2015:

3:30PM (PST) – Session -36/ Paper-4: Nanomechanical Characterization of SAC Solder Joints- Reduction of Aging Effects Using Microalloy Additions, Md Hasnine, Jeffery C. Suhling, Barton C. Prorok, Michael J. Bozack, and Pradeep Lall- Auburn University

AU Harsh Environments Workshop at SMTAI 2015

CAVE3 is co-organizer for the Harsh Environments Workshop at the SMTAI Conference to be held at the Donald Stephens Convention Center in Rosemont, Illinois from Sept 27-Oct 1, 2015.  The workshop will be jointly chaired by Prof(s) Pradeep Lall (AU), John Evans (AU), and Dr. Robert Kinyanjui (John Deere).   The workshop focuses on issues of relevance to the use of electronics in extreme environment applications.  The papers will focus on environments including thermal, thermo-mechanical, vibration, mechanical shock, corrosion, and contamination.  Design methods for the use of commercial off the shelf electronics in extreme environments will be presented in addition to modeling and design methods to ensure survivability over lifetimes much longer than expected in consumer applications.  SMTAI has been recognized as a truly different type of industry event because of the high quality technical information and the networking opportunities that cannot be found anywhere else in the industry.

Thematic Node on Harsh Environments on FlexTech Team for FHE-MII

Manufacturing plays a key role in spurring innovation and economic development.  The recent call for proposals for the formation of a National Network for Manufacturing Innovation focuses on the topic of Flexible Hybrid Electronics.  Auburn University is leading a thematic node on harsh environments on the FlexTech Team in response to the FOA for an IMI on the topic of Flexible Hybrid Electronics.  The thematic node team in addition to AU consists of key players from categories of material suppliers, equipment makers and system integrators.  Flexible electronics has been identified as one of the frontier goals by the National Academies of Engineering Reports on Leading Edge Engineering in 2013.  In order to make flexible electronics possible, processes must meet the demands of soft, pliant and often easily damaged surfaces.  Compatibility with delicate surface often requires low temperature processing.  There are no large flexible electronics manufacturing firms in the US engaged in large scale commercial manufacturing of products that integrate flexible and printed electronics technologies.  Thirty years ago when large corporate laboratories were prevalent, applied research and practical application of science used to be an area of strength in the United States.  However, pricing pressures, commoditization of products, and the migration of manufacturing to the Far East has resulted in the downsizing and many cases elimination of the corporate research laboratories.  There is a chasm between the laboratory research and the realization of commercialized products.  The global flexible electronics industry is in its infancy as scaled up production for commercial applications exists in only a few niche areas including e-paper, RFID tags and organic light emitting diode screens.  An IMI in the area of flexible electronics will fill in the void between lab research and commercial products.  The semiconductor manufacturing is highly automated, utilizing complex processes developed by multiple vendors which cannot be readily integrated without coordination between players.  The manufacturing challenges exist at multiple levels including raw materials, material handling, fabrication and assembly.  Processing at low temperatures on conformal bendable, stretchable and foldable substrates is needed or device assembly integration.  Adequate survivability in harsh applications will require development of flexible encapsulation approaches in addition to physical packaging and common interconnects and interfaces.  Stretchable electronics will need device designs for mitigating the interconnect failures due to fracture and delamination under large deformation and strain.  Innovative thermal management schemes are needed to ensure thermal and thermo-mechanical survivability in the presence of multi-material thin-film interfaces.  In parallel with the development of manufacturing protocols, it is envisioned that the development of modeling tools and prediction methods is needed to assess the device design, layout, and fabrication parameters.  Accelerated test methods and test conditions which have been developed for rigid electronics will need to be scaled to flexible hybrid electronics.  The existence of the prior research expertise in the area of harsh environment electronics for automotive and military environments uniquely positions the AU led thematic node to put together a successful IMI-node in the area of flexible hybrid electronics.