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Copper-Aluminum Wirebond Interconnects

CuAlWB

Synopsis

Automotive electronics is migrating to copper, palladium-coated copper and silver wire for wirebonding.  Copper and Silver wire is finding increasing applications in high power electronics operating at 50V-300V used for propulsion, transmission and control in emerging hybrid electric (HEV) and electric vehicles (EV).  Potential advantages of transition to Cu-Al wire bond system includes low cost of copper wire, lower thermal resistivity, lower electrical resistivity, higher deformation strength, damage during ultrasonic squeeze, and stability compared to gold wire. However, the transition to the copper wire brings along some trade-offs including poor corrosion resistance, narrow process window, higher hardness, and potential for cratering.  Research focuses on development of corrosion life prediction models during operation at high voltage at extreme temperatures.

Representative Recent Publications

  1. Lall, P., Luo, Y., Nguyen, L., Multiphysics Life-Prediction Model Based on Measurement of Polarization Curves for Copper-Aluminum Intermetallics, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 1027- 1039, May 31- June 3, 2016.
  2. Lall, P., Deshpande S., Nguyen, L., Principal Components Regression Model for Prediction of Acceleration Factors for Copper- Aluminum Wirebonds Subjected to Harsh Environments, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 637- 648, May 31- June 3, 2016.
  3. Lall, P., Luo, Y., Nguyen, L., De-Bonding Simulation of Cu-Al Wire Bond Intermetallic Compound Layers, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 862-871, May 31- June 3, 2016.
  4. Lall, P., Deshpande, S., Nguyen, L., Prognostication of Cu-Al WB System Subjected to High Temperature-Humidity Condition, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 887- 898, May 31- June 3, 2016.
  5. Lall, P., Deshpande, S., Nguyen, L., Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded with Different EMC’s, Paper IPACKICNMM2015-48638; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-13, July 6-9, 2015
  6. Lall, P., Luo, Y., Nguyen, L., Chlorine Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages, Paper IPACKICNMM2015-48639; Session 1-3-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-12, July 6-9, 2015
  7. Lall, P., Y. Luo, L. Nguyen, Multiphysics- Modeling Corrosion in Copper-Aluminum Interconnects in High Humidity Environments, Proceedings of the 65th ECTC, San Diego, CA, pp. 1045-1056, May 26-29, 2015
  8. Lall, P., Deshpande, S., Nguyen, L., Murtuza, M., Prognostication of Copper-Aluminum Wirebond Reliability under High Temperature Storage and Temperature-Humidity, Electronic Components and Technology Conference, 64th ECTC, pp. 1973-1985, Orlando, FL, May 27-30, 2014.
  9. Lall, P., Deshpande, S., Nguyen, L., High Temperature Storage and HAST Reliability of Copper-Aluminum Wirebond Interconnects, ASME International Congress and Exhibition (IMECE), Montreal, Canada, Paper Number IMECE2014-39524, Session 13-17-1, pp. 1-14, November 14-20, 2014.
  10. Lall, P., Deshpande, S., Nguyen, L., Murtuza, M., Damage Mechanisms in Copper-Aluminum Wirebond Under High Temperature Operation, 14th IEEE ITHERM Conference, pp. 1171-1178, Orlando, FL, May 27-30, 2014.

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