Flexible hybrid electronics allows the development of stretchable, bendable, foldable form-factors in electronics applications, which have not been possible with the use of rigid electronics technologies. The existing electronics ecosystem and supply-chain is geared towards the manufacture of rigid electronics. The manufacture of thin electronic architectures requires the development of solutions for unique challenges including the integration of thin-chips, flexible encapsulation, compliant interconnects, and development of stretchable inks for metallization traces. Furthermore, the integration of flexible hybrid electronics into high-reliability architectures requires the development of testing protocols to meaningfully inform manufacturing processes and ensure reliability and survivability under exposure to sustained harsh environmental operating conditions.
- Lall, P., Zhang, H., Prognostication of Remaining Useful Life for Flexible Batteries in Foldable Electronics, Proceedings of the IEEE PHM Conference, Ottawa, Canada, pp. 1-10, June 20-22, 2016.
- Lall, P., Zhang, H., Survivability Assessment of Flexible Batteries in Electronics, Proceedings of the 15th Annual Flexible & Printed Electronics Conference & Exhibition, pp. 1-32, Feb 29-Mar 2, 2016.