The focus of the research effort is on understanding the underlying relationships in process parameters and product variation for subtractive, semi-additive, and additive manufacturing solutions. Processes used in the manufacture of flexible hybrid electronics are being studied for wearable and harsh environment applications. Physics based relationships will be developed between reflow processes, assembly-warpage, resolution, thickness and sheet resistance, tolerance, print consistency – line edge roughness, loss or gain in dimension, uniformity in thickness, layer roughness, and yield.
- Lall, P., Patel, K., Narayan, K., Model for Inverse Determination of Process and Material Parameters for Control of Package-on-Package Warpage, IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume 5, No. 9., pp. 1358 – 1375, Sept 2015.
- Lall, P., Deshpande, S., Nguyen, L., Development of Model for Identification of Process Parameters for Wet Decapsulation of Copper-Aluminum Wirebond in PEMs, IEEE Transactions on Components, Packaging and Manufacturing Technology, Volume 7, Issue 8, pp. 1280-1292, August 2017
- Lall, P., and K. Goyal, Study on the Effect of Fixtures on Deformation and Warpage of the Double-Sided Flexible Printed Circuit Board through Reflow Using DIC, in Proceedings of the 16th ITherm, Orlando, Fl, pp. 1306-1314, May 30 – June 2, 2017.
- Lall, P., H. Zhang and R. Lall, Design and Development of Biometric Sensor Wearable Band Using Flexible Electronics, in Proceedings of the ASME Interpack 2017, California, pp. 1-10 , August 29 – September 1, 2017.