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Recent Publications

JOURNAL PUBLICATIONS

  1. Lall, P., Mirza, K., Assessment of the Effect of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure, SMTA Journal, Vol 28, No. 4, pp. 28-42, Dec 2015.
  2. Lall, P., Zhang, H., Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter, ASME Journal of Electronic Packaging, Volume 137, No. 2, doi: 10.1115/1.4028957, pp. 1-10, June 2015
  3. Lall, P., Sakalaukus, P., Davis, L., Reliability and Failure Modes of Solid-State Lighting Electrical Drivers Subjected to Accelerated Aging, IEEE Access Journal, Vol. 3, pp. 531-542, May 2015
  4. Lall, P., Wei, J., Prediction of L70 Life and Assessment of Color Shift for Solid State Lighting Using Kalman Filter and Extended Kalman Filter Based Models, IEEE Transactions on Device and Materials Reliability, Volume. 15, No.1, doi 10.1109/TDMR.2014.2369859, pp. 1-15, March 2015.
  5. Lall, P., Shantaram, S., Suhling, J., Locker, D., Stress-Strain Behavior of SAC305 at High Strain Rates, ASME Journal of Electronic Packaging, Volume 137, No. 1, doi:10.1115/1.4028641, pp. 1-16, March 2015.
  6. Lall, P., Lowe, R., Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Reliability Under Vibration, ASME Journal of Electronic Packaging, Volume 136, No. 4, doi:10.1115/1.4028163, pp. 1-8, December 2014.
  7. Lall, P., Shantaram, S., Locker, D., High Strain Rate Properties of SAC105 and SAC305 Leadfree Alloys after Extended High Temperature Storage, Journal of the SMTA, Volume 27, No. 1, pp. 13-27, 2014

CONFERENCE PUBLICATIONS

2016

  1. Lall, P., Deshpande, S., Nguyen, L., ANN Based RUL Assessment of Copper-Aluminum Wirebonds Subjected to Harsh Environments, Proceedings of the IEEE PHM Conference, Ottawa, Canada, pp. 1-10, June 20-22, 2016
  2. Lall, P., Zhang, H., Prognostication of Remaining Useful Life for Flexible Batteries in Foldable Wearable Electronics, Proceedings of the IEEE PHM Conference, Ottawa, Canada, pp. 1-10, June 20-22, 2016.
  3. Lall, P., Luo, Y., Nguyen, L., Multiphysics Life-Prediction Model Based on Measurement of Polarization Curves for Copper-Aluminum Intermetallics, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 1027- 1039, May 31- June 3, 2016.
  4. Lall, P., Wei, J., Remaining Useful Life Assessment of Field Deployed Electronics Using X-ray Micro-CT Based Digital Volume Correlation and Finite- Element Analysis, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 1583- 1593, May 31- June 3, 2016.
  5. Lall, P., Deshpande S., Nguyen, L., Principal Components Regression Model for Prediction of Acceleration Factors for Copper- Aluminum Wirebonds Subjected to Harsh Environments, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 637- 648, May 31- June 3, 2016.
  6. Lall, P., Dornala K., Suhling, J., Lowe, R., Foley, J., Life Prediction and RUL Assessment of Fine Pitch Solder Joint Fuze Electronics Under Mechanical Shock Loads Up To 50,000g, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 232- 244, May 31- June 3, 2016.
  7. Lall, P., Zhang, D., Yadav, V., Suhling, J., Locker, D., Effect of Temperature on the High Strain Rate Properties of SAC Leadfree Alloys at Temperatures Up to 200C, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 1924- 1933, May 31- June 3, 2016.
  8. Nguyen, Q., Roberts, J., Suhling, J., Jaeger, R., Lall, P., Characterization of Moisture Induced Die Stresses in Flip Chip Packaging, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 789- 799, May 31- June 3, 2016.
  9. Fu, N., Suhling, J., Lall, P., Cyclic Stress- Strain Behavior of SAC305 Lead Free Solder: Effects of Aging, Temperature, Strain Rate, and Plastic Strain Range, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 1119- 1128, May 31- June 3, 2016.
  10. Lall, P., Sakalaukus, P., Davis, L., Improvements to the IES TM-28-14 Lumen Maintenance Standard: A Generalized Acceleration Factor Approach for Solid-State Lighting, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 1342- 1352, May 31- June 3, 2016.
  11. Lall, P., Abrol, A., Simpson, L., Glover, J., A Study of Damage Progression in MEMS Based Silicon Oscillators Subjected to High-G, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 546-560, May 31- June 3, 2016.
  12. Lall, P., Kothari, N., Foley, J., Deep, J., Lowe, R., A Novel Micro-CT Based Finite Element Modeling Technique to Study Reliability of Densely Packed Fuze Assemblies, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 456- 464, May 31- June 3, 2016.
  13. Lall, P., Yadav, V., Suhling, J., Locker, D., High Strain Rate Stress-Strain Measurement of SAC105 Leadfree Alloy at Temperatures up to 200C, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 1225- 1236, May 31- June 3, 2016.
  14. Lall, P., Luo, Y., Nguyen, L., De-Bonding Simulation of Cu-Al Wire Bond Intermetallic Compound Layers, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 862-871, May 31- June 3, 2016.
  15. Lall, P., Zhang, H., Davis, L., A Comparison of Temperature and Humidity Effects on Phosphor Converted LED Package and the Prediction of Remaining Useful Life with State Estimation, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 207- 217, May 31- June 3, 2016.
  16. Lall, P., Wei, J., PBGA Package Finite Element Analysis Based on the Physical Geometry Modeling Using X-ray Micro-CT Digital Volume Reconstruction, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 285- 295, May 31- June 3, 2016.
  17. Lall, P., Deshpande, S., Nguyen, L., Prognostication of Cu-Al WB System Subjected to High Temperature-Humidity Condition, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 887- 898, May 31- June 3, 2016.
  18. Lall, P., Dornala, K., Lowe, R., Foley, J., Survivability Assessment of Electronics Subjected to Mechanical Shock Up to 25,000g, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 507- 519, May 31- June 3, 2016.
  19. Lall, P., Mirza, K., Suhling, J., A Study on the Effect of Aging on Thermal Cycling Reliability of Sn-Ag-Cu Interconnects Using Digital Image Correlation, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 519- 530, May 31- June 3, 2016.
  20. Roberts, J., Bhat, C., Suhling, J., Jaeger, R., Lall, P., Reliability of a CBGA Microprocessor Package Incorporating a Decoupling Capacitor Array, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 278- 285, May 31- June 3, 2016.
  21. Basit, M., Ahmed, S., Motalab, M., Roberts, J., Suhling, J., Lall, P., The Anand Parameters for SAC Solders after Extreme Aging, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 440- 448, May 31- June 3, 2016.
  22. Chen, C., Suhling, J., Lall, P., Improved Meshing Strategy for Finite Element Modeling of PBGA Thermal Cycling, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 448- 456, May 31- June 3, 2016.
  23. Motalab, M., Mustafa, M., Suhling, J., Lall, P., Improved Predictions of Cyclic Stress-Strain Curves for Lead Free Solders Using the Anand Visocplastic Constitutive Model, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 471- 481, May 31- June 3, 2016.
  24. Fu, N., Suhling, J., Mustafa, M., Lall, P., Aging Induced Evolution of the Cyclic Stress-Strain Behavior of Lead Free Solders, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 737- 746, May 31- June 3, 2016.
  25. Ahmed, S., Basit, M., Suhling, J., Lall, P., Effects of Aging on SAC-Bi Solder Material, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 746- 755, May 31- June 3, 2016.
  26. Alam, M., Basit, M., Suhling, J., Lall, P., Mechanical Characterization of SAC305 Lead Free Solder at High Temperatures, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 755- 761, May 31- June 3, 2016.
  27. Chowdhury, M., Ahmed, S., Fahim, A., Suhling, J., Lall, P., Mechanical Characterization of Doped SAC Solder Materials at High Temperature, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 1202- 1209, May 31- June 3, 2016.
  28. Fahim, A., Ahmed, S., Chowdhury, M., Suhling, J., Lall, P., High Temperature Creep Response of Lead Free Solders, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 1218- 1225, May 31- June 3, 2016.

2015

  1. Lall, P., Deshpande, S., Nguyen, L., Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded with Different EMC’s, Paper IPACKICNMM2015-48638; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-13, July 6-9, 2015
  2. Lall, P., Sakalaukus, P., Davis, L., An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions, Paper IPACKICNMM2015-48257; Session 1-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-7, July 6-9, 2015
  3. Lall, P., Luo, Y., Nguyen, L., Chlorine Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages, Paper IPACKICNMM2015-48639; Session 1-3-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-12, July 6-9, 2015
  4. Lall, P., Zhang, H., Davis, L., Discoloration and Failure Mechanism Analysis of High Power pc-LED Under Harsh Environment in Presence of Contamination, Paper IPACKICNMM2015-48724; Session 1-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-9, July 6-9, 2015
  5. Lall, P., Wei, J., LED Chip Deformation Measurement During the Operation Using the X-ray CT Digital Volume Correlation, Paper IPACKICNMM2015-48785; Session 14-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-6, July 6-9, 2015
  6. Lall, P., Abrol, A., Simpson, L., Glover, J., Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Shock Environments, Paper IPACKICNMM2015-48790; Session 3-1-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-11, July 6-9, 2015
  7. Lall, P., Yadav, V., Suhling, J., Locker, D., A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures, Paper IPACKICNMM2015-48389; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-17, July 6-9, 2015
  8. Lall, P., Kothari, N., Glover, J., Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments, Paper IPACKICNMM2015-48457; Session 3-3-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-9, July 6-9, 2015
  9. Lall, P., Mirza, K., Suhling, J., DIC Based Investigation into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint, Paper IPACKICNMM2015-48727, Session 14-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-13, July 6-9, 2015
  10. Basit, M., M. Motalab, J. C. Suhling, P. Lall, Viscoplastic Constitutive Model For Lead-Free Solder Including Effects Of Silver Content, Solidification Profile and Severe Aging, Paper IPACKICNMM2015-48619, Session 14-2-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-18, July 6-9, 2015
  11. Basit, M., M. Motalab, J. C. Suhling, J. L. Evans, P. Lall, FEA Based Reliability Predictions For Pbga Packages Subjected To Isothermal Aging Prior To Thermal Cycling, Paper IPACKICNMM2015-48620, Session 1-6-4, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-11, July 6-9, 2015
  12. Chowdhury, P. R., N. J. Chhanda, J. C. Suhling, P. Lall, Experimental Characterization Of Underfill Materials Exposed To Moisture Including Preconditioning, Paper IPACKICNMM2015-48622, 14-3-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-9, July 6-9, 2015
  13. Hasnine, M., J. C. Suhling, B. C. Prorok, M. J. Bozack, P. Lall, Characterization of The Effects of Silver Content on The Aging Resistance of SAC Solder Joints, Paper IPACKICNMM2015-48623, 14-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-15, July 6-9, 2015
  14. Ahmed, S., M. Basit, J. C. Suhling, P. Lall, Characterization of Doped SAC Solder Materials and Determination of Anand Parameters, Paper IPACKICNMM2015-48624, 14-2-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-14, July 6-9, 2015
  15. Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall, Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies, Paper IPACKICNMM2015-48626, 1-6-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-13, July 6-9, 2015
  16. Lall, P., and H. Zhang, L. Davis, Failure Mechanisms and Color Stability in Light-Emitting Diodes during Operations in High-Temperature Environments in Presence of Contamination, Proceedings of the 65th ECTC, San Diego, CA, pp. 1624-1632, May 26-29, 2015
  17. Basit, M., M. Motalab, J. C. Suhling, Z. Hai, J. Evans, M. Bozack, and P. Lall, Thermal Cycling Reliability of Aged PBGA Assemblies- Comparison of Weibull Failure Data and Finite Element Model Predictions, Proceedings of the 65th ECTC, San Diego, CA, pp. 106-117, May 26-29, 2015
  18. Lall, P., and J. Wei, X-Ray Micro- CT and Digital- Volume Correlation Based Three- Dimensional Measurements of Deformation and Strain in Operational Electronics, Proceedings of the 65th ECTC, San Diego, CA, pp. 406-416, May 26-29, 2015
  19. Lall, P., D. Zhang, and J. Suhling, High Strain Rate Properties of SAC305 Lead Free Solder at High Operating Temperature after Long-Term Storage, Proceedings of the 65th ECTC, San Diego, CA, pp. 640-651, May 26-29, 2015
  20. Lall, P., S. M. Duraisamy, J. Suhling, J. Evans, Principal Components Regression Model for Prediction of Life-Reduction in SAC Lead Free Interconnects During Long-Term High Temperature Storage, Proceedings of the 65th ECTC, San Diego, CA, pp. 2040-2047, May 26-29, 2015
  21. Lall, P., Y. Luo, L. Nguyen, Multiphysics- Modeling Corrosion in Copper-Aluminum Interconnects in High Humidity Environments, Proceedings of the 65th ECTC, San Diego, CA, pp. 1045-1056, May 26-29, 2015
  22. Hasnine, M., J. C. Suhling, B. C. Prorok, M. J. Bozack, P. Lall, Nanomechanical Characterization of SAC Solder Joints- Reduction of Aging Effects Using Microalloy Additions, Proceedings of the 65th ECTC, San Diego, CA, pp. 1574-1585, May 26-29, 2015
  23. Lall, P., Zhang, D., Yadav, V., Locker, D., KEYNOTE PRESENTATION: High Strain-Rate Constitutive Behavior of SAC105 and SAC305 Leadfree Solder During Operation at High Temperature, Proceedings of the EuroSIME, Budapest, Hungary, pp. 1-11, April 19-22, 2015.
  24. Lall, P., Wei, J., Sakalaukus, P., KEYNOTE PRESENTATION: Bayesian Models for Life Prediction and Fault-Mode Classification in Solid State Lamps, Proceedings of the EuroSIME, Budapest, Hungary, pp. 1-13, April 19-22, 2015.