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Short CV

PRADEEP LALL, Ph.D., MBA, IEEE Fellow

MacFarlane Endowed Distinguished Professor, Dept of Mechanical Engineering
Technical and Governing Council, NextFlex Manufacturing Institute
Director, NSF-CAVE3 Electronics Research Center
Auburn University, Auburn, AL 36849
Tele: (334) 844-3424, FAX: (334) 844-3450, Email: lall@auburn.edu

EDUCATION

Ph.D., Mechanical Engineering,
University of Maryland (1993)
M.B.A, Finance and Strategy,
Kellogg School of Management, Northwestern University (2002)
M.S., Mechanical Engineering,
University of Maryland (1989)
B.E., Mechanical Engineering,
Delhi College of Engineering, University of Delhi (1988)

APPOINTMENTS

2019 – Present      
John and Anne MacFarlane Endowed Distinguished Professor and Director, Auburn University
2015-2019
John and Anne MacFarlane Endowed Professor and Director, Auburn University
2008 – 2015
Thomas Walter Professor & Director, Auburn University
2006 – 2008
Thomas Walter Professor & Associate Director, Auburn University
2005 – 2006
Thomas Walter Associate Professor & Associate Director, Auburn University
2004 – 2005
Associate Professor & Associate Director, Auburn University
2002 – 2004
Associate Professor, Auburn University
1994 – 2002
Lead Engineer-to-Distinguished Member of Technical Staff, Motorola, Inc.
1992 – 1994
Assistant Director, CALCE Center

 SELECTED RELEVANT CONFERENCE PUBLICATIONS (507 CONFERENCE PAPERS)
  1. Lall, P., Deshpande, S., Nguyen, L., ANN Based RUL Assessment of Copper-Aluminum Wirebonds Subjected to Harsh Environments, Proceedings of the IEEE PHM Conference, Ottawa, Canada, pp. 1-10, June 20-22, 2016
  2. Lall, P., Zhang, H., Prognostication of Remaining Useful Life for Flexible Batteries in Foldable Wearable Electronics, Proceedings of the IEEE PHM Conference, Ottawa, Canada, pp. 1-10, June 20-22, 2016.
  3. Lall, P., Luo, Y., Nguyen, L., Multiphysics Life-Prediction Model Based on Measurement of Polarization Curves for Copper-Aluminum Intermetallics, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 1027- 1039, May 31- June 3, 2016.
  4. Lall, P., Wei, J., Remaining Useful Life Assessment of Field Deployed Electronics Using X-ray Micro-CT Based Digital Volume Correlation and Finite- Element Analysis, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 1583- 1593, May 31- June 3, 2016.
  5. Lall, P., Deshpande S., Nguyen, L., Principal Components Regression Model for Prediction of Acceleration Factors for Copper- Aluminum Wirebonds Subjected to Harsh Environments, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 637- 648, May 31- June 3, 2016.
  6. Lall, P., Dornala K., Suhling, J., Lowe, R., Foley, J., Life Prediction and RUL Assessment of Fine Pitch Solder Joint Fuze Electronics Under Mechanical Shock Loads Up To 50,000g, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 232- 244, May 31- June 3, 2016.
  7. Lall, P., Zhang, D., Yadav, V., Suhling, J., Locker, D., Effect of Temperature on the High Strain Rate Properties of SAC Leadfree Alloys at Temperatures Up to 200C, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 1924- 1933, May 31- June 3, 2016.
  8. Nguyen, Q., Roberts, J., Suhling, J., Jaeger, R., Lall, P., Characterization of Moisture Induced Die Stresses in Flip Chip Packaging, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 789- 799, May 31- June 3, 2016.
  9. Fu, N., Suhling, J., Lall, P., Cyclic Stress- Strain Behavior of SAC305 Lead Free Solder: Effects of Aging, Temperature, Strain Rate, and Plastic Strain Range, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 1119- 1128, May 31- June 3, 2016.
  10. Lall, P., Sakalaukus, P., Davis, L., Improvements to the IES TM-28-14 Lumen Maintenance Standard: A Generalized Acceleration Factor Approach for Solid-State Lighting, Proceedings of the 66th ECTC, Las Vegas, Nevada, pp. 1342- 1352, May 31- June 3, 2016.
  11. Lall, P., Abrol, A., Simpson, L., Glover, J., A Study of Damage Progression in MEMS Based Silicon Oscillators Subjected to High-G, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 546-560, May 31- June 3, 2016.
  12. Lall, P., Kothari, N., Foley, J., Deep, J., Lowe, R., A Novel Micro-CT Based Finite Element Modeling Technique to Study Reliability of Densely Packed Fuze Assemblies, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 456- 464, May 31- June 3, 2016.
  13. Lall, P., Yadav, V., Suhling, J., Locker, D., High Strain Rate Stress-Strain Measurement of SAC105 Leadfree Alloy at Temperatures up to 200C, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 1225- 1236, May 31- June 3, 2016.
  14. Lall, P., Luo, Y., Nguyen, L., De-Bonding Simulation of Cu-Al Wire Bond Intermetallic Compound Layers, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 862-871, May 31- June 3, 2016.
  15. Lall, P., Zhang, H., Davis, L., A Comparison of Temperature and Humidity Effects on Phosphor Converted LED Package and the Prediction of Remaining Useful Life with State Estimation, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 207- 217, May 31- June 3, 2016.
  16. Lall, P., Wei, J., PBGA Package Finite Element Analysis Based on the Physical Geometry Modeling Using X-ray Micro-CT Digital Volume Reconstruction, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 285- 295, May 31- June 3, 2016.
  17. Lall, P., Deshpande, S., Nguyen, L., Prognostication of Cu-Al WB System Subjected to High Temperature-Humidity Condition, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 887- 898, May 31- June 3, 2016.
  18. Lall, P., Dornala, K., Lowe, R., Foley, J., Survivability Assessment of Electronics Subjected to Mechanical Shock Up to 25,000g, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 507- 519, May 31- June 3, 2016.
  19. Lall, P., Mirza, K., Suhling, J., A Study on the Effect of Aging on Thermal Cycling Reliability of Sn-Ag-Cu Interconnects Using Digital Image Correlation, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 519- 530, May 31- June 3, 2016.
  20. Roberts, J., Bhat, C., Suhling, J., Jaeger, R., Lall, P., Reliability of a CBGA Microprocessor Package Incorporating a Decoupling Capacitor Array, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 278- 285, May 31- June 3, 2016.
  21. Basit, M., Ahmed, S., Motalab, M., Roberts, J., Suhling, J., Lall, P., The Anand Parameters for SAC Solders after Extreme Aging, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 440- 448, May 31- June 3, 2016.
  22. Chen, C., Suhling, J., Lall, P., Improved Meshing Strategy for Finite Element Modeling of PBGA Thermal Cycling, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 448- 456, May 31- June 3, 2016.
  23. Motalab, M., Mustafa, M., Suhling, J., Lall, P., Improved Predictions of Cyclic Stress-Strain Curves for Lead Free Solders Using the Anand Visocplastic Constitutive Model, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 471- 481, May 31- June 3, 2016.
  24. Fu, N., Suhling, J., Mustafa, M., Lall, P., Aging Induced Evolution of the Cyclic Stress-Strain Behavior of Lead Free Solders, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 737- 746, May 31- June 3, 2016.
  25. Ahmed, S., Basit, M., Suhling, J., Lall, P., Effects of Aging on SAC-Bi Solder Material, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 746- 755, May 31- June 3, 2016.
  26. Alam, M., Basit, M., Suhling, J., Lall, P., Mechanical Characterization of SAC305 Lead Free Solder at High Temperatures, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 755- 761, May 31- June 3, 2016.
  27. Chowdhury, M., Ahmed, S., Fahim, A., Suhling, J., Lall, P., Mechanical Characterization of Doped SAC Solder Materials at High Temperature, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 1202- 1209, May 31- June 3, 2016.
  28. Fahim, A., Ahmed, S., Chowdhury, M., Suhling, J., Lall, P., High Temperature Creep Response of Lead Free Solders, Proceedings of the ITHERM 2016, Las Vegas, Nevada, pp. 1218- 1225, May 31- June 3, 2016.
  29. Lall, P., Deshpande, S., Nguyen, L., Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded with Different EMC’s, Paper IPACKICNMM2015-48638; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-13, July 6-9, 2015
  30. Lall, P., Sakalaukus, P., Davis, L., An Investigation of Catastrophic Failure in Solid-State Lamps Exposed to Harsh Environment Operational Conditions, Paper IPACKICNMM2015-48257; Session 1-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-7, July 6-9, 2015
  31. Lall, P., Luo, Y., Nguyen, L., Chlorine Ion Related Corrosion in Cu-Al Wirebond Microelectronic Packages, Paper IPACKICNMM2015-48639; Session 1-3-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-12, July 6-9, 2015
  32. Lall, P., Zhang, H., Davis, L., Discoloration and Failure Mechanism Analysis of High Power pc-LED Under Harsh Environment in Presence of Contamination, Paper IPACKICNMM2015-48724; Session 1-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-9, July 6-9, 2015
  33. Lall, P., Wei, J., LED Chip Deformation Measurement During the Operation Using the X-ray CT Digital Volume Correlation, Paper IPACKICNMM2015-48785; Session 14-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-6, July 6-9, 2015
  34. Lall, P., Abrol, A., Simpson, L., Glover, J., Survivability of MEMS Accelerometer Under Sequential Thermal and High-G Shock Environments, Paper IPACKICNMM2015-48790; Session 3-1-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-11, July 6-9, 2015
  35. Lall, P., Yadav, V., Suhling, J., Locker, D., A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures, Paper IPACKICNMM2015-48389; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-17, July 6-9, 2015
  36. Lall, P., Kothari, N., Glover, J., Mechanical Shock Reliability Analysis and Multiphysics Modeling of MEMS Accelerometers in Harsh Environments, Paper IPACKICNMM2015-48457; Session 3-3-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-9, July 6-9, 2015
  37. Lall, P., Mirza, K., Suhling, J., DIC Based Investigation into the Effect of Mean Temperature of Thermal Cycle on the Strain State in SnAgCu Solder Joint, Paper IPACKICNMM2015-48727, Session 14-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-13, July 6-9, 2015
  38. Basit, M., M. Motalab, J. C. Suhling, P. Lall, Viscoplastic Constitutive Model For Lead-Free Solder Including Effects Of Silver Content, Solidification Profile and Severe Aging, Paper IPACKICNMM2015-48619, Session 14-2-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-18, July 6-9, 2015
  39. Basit, M., M. Motalab, J. C. Suhling, J. L. Evans, P. Lall, FEA Based Reliability Predictions For Pbga Packages Subjected To Isothermal Aging Prior To Thermal Cycling, Paper IPACKICNMM2015-48620, Session 1-6-4, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-11, July 6-9, 2015
  40. Chowdhury, P. R., N. J. Chhanda, J. C. Suhling, P. Lall, Experimental Characterization Of Underfill Materials Exposed To Moisture Including Preconditioning, Paper IPACKICNMM2015-48622, 14-3-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-9, July 6-9, 2015
  41. Hasnine, M., J. C. Suhling, B. C. Prorok, M. J. Bozack, P. Lall, Characterization of The Effects of Silver Content on The Aging Resistance of SAC Solder Joints, Paper IPACKICNMM2015-48623, 14-5-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-15, July 6-9, 2015
  42. Ahmed, S., M. Basit, J. C. Suhling, P. Lall, Characterization of Doped SAC Solder Materials and Determination of Anand Parameters, Paper IPACKICNMM2015-48624, 14-2-2, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-14, July 6-9, 2015
  43. Quang Nguyen, Jordan C. Roberts, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall, Measurement and Simulation of Moisture Induced Die Stresses in Flip Chip on Laminate Assemblies, Paper IPACKICNMM2015-48626, 1-6-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-13, July 6-9, 2015
  44. Lall, P., and H. Zhang, L. Davis, Failure Mechanisms and Color Stability in Light-Emitting Diodes during Operations in High-Temperature Environments in Presence of Contamination, Proceedings of the 65th ECTC, San Diego, CA, pp. 1624-1632, May 26-29, 2015
  45. Basit, M., M. Motalab, J. C. Suhling, Z. Hai, J. Evans, M. Bozack, and P. Lall, Thermal Cycling Reliability of Aged PBGA Assemblies- Comparison of Weibull Failure Data and Finite Element Model Predictions, Proceedings of the 65th ECTC, San Diego, CA, pp. 106-117, May 26-29, 2015
  46. Lall, P., and J. Wei, X-Ray Micro- CT and Digital- Volume Correlation Based Three- Dimensional Measurements of Deformation and Strain in Operational Electronics, Proceedings of the 65th ECTC, San Diego, CA, pp. 406-416, May 26-29, 2015
  47. Lall, P., D. Zhang, and J. Suhling, High Strain Rate Properties of SAC305 Lead Free Solder at High Operating Temperature after Long-Term Storage, Proceedings of the 65th ECTC, San Diego, CA, pp. 640-651, May 26-29, 2015
  48. Lall, P., S. M. Duraisamy, J. Suhling, J. Evans, Principal Components Regression Model for Prediction of Life-Reduction in SAC Lead Free Interconnects During Long-Term High Temperature Storage, Proceedings of the 65th ECTC, San Diego, CA, pp. 2040-2047, May 26-29, 2015
  49. Lall, P., Y. Luo, L. Nguyen, Multiphysics- Modeling Corrosion in Copper-Aluminum Interconnects in High Humidity Environments, Proceedings of the 65th ECTC, San Diego, CA, pp. 1045-1056, May 26-29, 2015
  50. Hasnine, M., J. C. Suhling, B. C. Prorok, M. J. Bozack, P. Lall, Nanomechanical Characterization of SAC Solder Joints- Reduction of Aging Effects Using Microalloy Additions, Proceedings of the 65th ECTC, San Diego, CA, pp. 1574-1585, May 26-29, 2015
  51. Lall, P., Zhang, D., Yadav, V., Locker, D., KEYNOTE PRESENTATION: High Strain-Rate Constitutive Behavior of SAC105 and SAC305 Leadfree Solder During Operation at High Temperature, Proceedings of the EuroSIME, Budapest, Hungary, pp. 1-11, April 19-22, 2015.
  52. Lall, P., Wei, J., Sakalaukus, P., KEYNOTE PRESENTATION: Bayesian Models for Life Prediction and Fault-Mode Classification in Solid State Lamps, Proceedings of the EuroSIME, Budapest, Hungary, pp. 1-13, April 19-22, 2015.
SELECTED JOURNAL PUBLICATIONS (69 JOURNAL PUBLICATIONS)
  1. Lall, P., Mirza, K., Assessment of the Effect of Mean Temperature on Thermal Cycling Reliability of SAC Solder Joints Using Leading Indicators of Failure, SMTA Journal, Vol 28, No. 4, pp. 28-42, Dec 2015.
  2. Lall, P., Zhang, H., Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter, ASME Journal of Electronic Packaging, Volume 137, No. 2, doi: 10.1115/1.4028957, pp. 1-10, June 2015
  3. Lall, P., Sakalaukus, P., Davis, L., Reliability and Failure Modes of Solid-State Lighting Electrical Drivers Subjected to Accelerated Aging, IEEE Access Journal, Vol. 3, pp. 531-542, May 2015
  4. Lall, P., Wei, J., Prediction of L70 Life and Assessment of Color Shift for Solid State Lighting Using Kalman Filter and Extended Kalman Filter Based Models, IEEE Transactions on Device and Materials Reliability, Volume. 15, No.1, doi 10.1109/TDMR.2014.2369859, pp. 1-15, March 2015.
  5. Lall, P., Shantaram, S., Suhling, J., Locker, D., Stress-Strain Behavior of SAC305 at High Strain Rates, ASME Journal of Electronic Packaging, Volume 137, No. 1, doi:10.1115/1.4028641, pp. 1-16, March 2015.
  6. Lall, P., Lowe, R., Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Reliability Under Vibration, ASME Journal of Electronic Packaging, Volume 136, No. 4, doi:10.1115/1.4028163, pp. 1-8, December 2014.
  7. Lall, P., Shantaram, S., Locker, D., High Strain Rate Properties of SAC105 and SAC305 Leadfree Alloys after Extended High Temperature Storage, Journal of the SMTA, Volume 27, No. 1, pp. 13-27, 2014
  8. Lall, P., Limaye, G., SnAgCu Lead-Free Electronics Reliability Under Combined Temperature and Vibration Environments, Journal of the SMTA, Volume 26, No. 1, pp. 11-19, 2013.
  9. Lall, P., Gupta, P., Goebel, K., Decorrelated Feature Space and Neural Nets Based Framework for Failure Modes Clustering in Electronics Subjected to Mechanical Shock, IEEE Transactions on Reliability, Vol. 61, No. 4, pp. 884-900, December 2012.
  10. Lall, P., Choudhary, P., Gupte, S., Hofmeister, J., Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics Under Shock Loads, IEEE TCPT, Vol. 32(3), pp. 600-616, 2009.
  11. Lall, P., Hande, M., Bhat, C., More, V., Vaidya, R., Prognostication of system-state in lead-free electronics equipment under cyclic and steady-state thermo-mechanical loads, Microelectronics Reliability, Vol. 49(8), pp. 825-838, 2009.
  12. Lall, P., Islam, N., Choudhary, P., Suhling, J., Leading Indicators of Failure for Prognostication of Leaded and Lead-Free Electronics in Harsh Environments, IEEE TCPT, Vol. 32(1), pp. 135-144, 2009.
SYNERGISTIC ACTIVITIES
  1. Integration of Techniques into IPC-9703: Early published work on test methods for shock survivability of electronic components has been integrated into the test standard, 2006.
  2. Research Experience for Teachers, Integrated K-12 teachers in CAVE3 research program during the summers of 2002 through 2010, NSF-RET Supplements, 2002-2010.
  3. Lall, P., High-Temperature Electronics, NSF-CAVE3 Short Course, Duration: 4-hours, April 30, 2003.
  4. Hedging Risk in New Technology Ventures, Short-Course to Professional Engineers, Mechanical Engineering Alumni Conference, November 9-10, 2008.
 SELECTED AWARDS & HONORS (37 AWARDS AND HONORS)
  1. NSF-IUCRC Alex Schwarzkopf Prize for Technology Innovation (2016)
  2. Samuel-Ginn College of Engineering Senior Faculty Research Award (2016)
  3. Wright A. Gardner Award, Alabama Academy of Sciences (2016)
  4. IEEE-CPMT Exceptional Technical Achievement Award (2014)
  5. Fellow of the Alabama Academy of Sciences (2014)
  6. ASME Applied Mechanics Award, American Society of Mechanical Engineers, (2013)
  7. Recipient of Member of Technical Distinction Award, Surface Mount Technology Association, SMTA (2013).
  8. Creative Research and Scholarship Award, Auburn University (2013)
  9. SEC Faculty Achievement Award (2013)
  10. Best-of-Conference Session Paper Award, ECTC (2012)
  11. Ranked in Top 100 out of 1-Million most Cited Authors (2012)
  12. Fellow of IEEE (2012)
  13. Member, National Academies Committee on Electronics Vehicle Controls and Unintended Acceleration (2010)
  14. Fellow of ASME (2008)
  15. Samuel Ginn College of Engineering Sr Faculty Research Award (2007)
  16. Five Motorola Engineering Awards (1997, 1999)
  17. Three Motorola Outstanding Innovation Awards (1995-97). 
SELECTED BEST PAPER AWARDS (27 BEST-PAPER AWARDS)
  1. 2014-2015 ASME Journal of Electronic Packaging Best-Paper Award (2015); for paper: Lall, P., Lowe, R., Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Reliability Under Vibration, ASME Journal of Electronic Packaging, Volume 136, No. 4, doi:10.1115/1.4028163, pp. 041013-1-to 041013-8, December 2014.
  2. Best Poster-Paper Award: Lall, P., Deshpande, S., Nguyen, L., Fuming Acid Based Decapsulation Process for Copper-Aluminum Wirebond System Molded with Different EMC’s, Paper IPACKICNMM2015-48638; Session 14-2-1, ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK), San Francisco, CA, pp. 1-13, July 6-9, 2015.
  3. Best Poster-Paper Award: Lall, P., Deshpande, S., Nguyen, L., Murtuza, M., Damage Mechanisms in Copper-Aluminum Wirebond Under High Temperature Operation, 14th IEEE ITHERM Conference, pp. 1171-1178, Orlando, FL, May 27-30, 2014.
  4. Best Poster-Paper Award: Lall, P., Harsha, M., Suhling, J., Goebel, K., Damage Pre-Cursors Based Prognostication of Accrued Damage and Assessment of Operational Readiness of Lead-free Electronics, Proceedings of the ASME 2013 International Technical Conference & Exposition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK2013-73251, pp. 1-17, Burlingame, CA, 2013.
  5. Best-of-Conference Award: Lall, P., Patel, K., Lowe, R., Strickland, M., Blanche, J., Geist, D., Montgomery,  R., Modeling and Reliability Characterization of Area-Array Electronics Subjected to High-G Mechanical Shock Up to 50,000G, Proceedings of the 62nd ECTC, pp. 1194 – 1204, May 29-June 1, 2012.
  6. Best-of-Conference Award: Cai, Z., Zhang, Y., Suhling, J., Lall, P., Johnson, R. W., Bozack, M., Reduction of Lead Free Solder Aging Effects using Doped SAC Alloys, 60th ECTC, Las Vegas, Nevada, pp. 1493-1511, June 1-4, 2010.
  7. Best-of-Conference Award: Lall, P., Vaidya, R., More, V., Goebel, K., Interrogation Of Damage-State In Lead-Free Electronics Under Sequential Exposure To Thermal Aging And Thermal Cycling, SMTAI Technical Conference, Orlando, FL, pp. 405-418, Oct 24-28, 2010.
  8. Best Poster Award, EPPD Poster Contest, Lowe, R., Lall, P., Prognostication based on Resistance Spectroscopy for High Reliability Electronics in Shock Impact, ASME International Mechanical Engineering Congress and Exposition, Lake Buena Vista, Florida, Nov 13-19, 2009
  9. Best of Conference-Proceedings, Lall, P., Iyengar, D., Shantaram, S., Panchagade, D., Suhling, J., Survivability Assessment of SAC Leadfree Packaging Under Shock and Vibration using Optical High-Speed Imaging, SMTAI, pp. 519-531, Aug 17-21, 2008
  10. Best Paper in Test and Measurement Track, Intermittency Detection and Mitigation in Ball Grid Array (BGA) Packages, Hofmeister, J.P., Lall, P., Goodman, D., Ortiz, E.G., Adams, M.G.P., Tracy, T.A. , AUTOTESTCON, pp. 40-49, Sept 17-20, 2007.
  11. Best Session-Paper Award, Fundamentals of Delamination Initiation and Growth in Flip Chip Assemblies, M. K. Rahim, J. C. Suhling, R. C. Jaeger, and P. Lall, Proceedings of the 55th ECTC, Orlando, FL, pp. 1172-1186, June 1-3, 2005.
ENGINEERING AWARDS
  1. Algorithm to Prevent CPU Overflow, P. Lall, S. Potter, Engineering Award, 1997.
  2. Automated IC Package Pad Array Generation, P. Lall, S. Potter, Engineering Award, 1999.
  3. Method for Solder Joint Geometry Generation, P. Lall, K. Banerji, Engineering Award, 1999.
JOURNAL EDITORSHIPS (7 POSITIONS HELD)
  1. Associate Editor, IEEE Access Journal, 2014 – Present.
  2. Associate Editor, IEEE Transactions on Components & Pkg. Technologies, 2003 to present.
  3. Associate Editor, ASME Journal of Electronic Packaging, 2004 to 2011.
  4. Associate Editor, IEEE Transactions Component Packaging Manufacturing, 1997 to 2011
SELECTED SOCIETY, CONFERENCE AND SESSION CHAIRMANSHIPS (94 POSITIONS HELD)
  1. 2013 – Present: Member IEEE Reliability Society AdCom, 2013.
  2. 2012 – 2013: Congress Steering Committee Chair, IMECE 2013 – ASME
  3. 2010 – 2011: Chair, Modeling and Simulation Committee – ECTC